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High thermal conductivity epoxy resin Product List

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High thermal conductivity epoxy resin TE-7162 (1Wm/k)

High thermal conductivity epoxy resin TE-7162 (1Wm/k)

It is a fast-curing, low-viscosity epoxy resin with high thermal conductivity. Please use it for heat dissipation insulation sealing of electronic devices such as motors, coils, and capacitors.

TE-7162 Two-component heating curing epoxy resin Features: High thermal conductivity, short curing time, low viscosity Applications: Heat dissipation insulation sealing for electronic devices such as industrial motors, coils, transformers, and capacitors ■ Thermal conductivity: 1.0 (W/mK) * For more details, please download the specification sheet from below. * For other thermal conductive resin products, please download the catalog for epoxy & acrylic resins "TERADITE" from below.

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High thermal conductivity epoxy resin TE-7900 (3Wm/k)

High thermal conductivity epoxy resin TE-7900 (3Wm/k)

Low viscosity high thermal conductivity epoxy resin. It is ideal for potting electrical and electronic components that require heat dissipation.

TE-7900 Two-component heating curing epoxy resin Features: High thermal conductivity (heat dissipation), excellent workability of 3W/mK, low viscosity, environmentally friendly (non-lead, non-halogen), low thermal expansion *The linear expansion coefficient is low at 16, making it less prone to cracking. Applications: Heat dissipation insulation sealing for industrial motors, coils, transformers, capacitors, etc. ■ Thermal conductivity: 3.0 (W/mK) *For more details, please download the PDF from below or feel free to contact us.

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High Thermal Conductivity Epoxy Resin for Semiconductors TE-7163

High Thermal Conductivity Epoxy Resin for Semiconductors TE-7163

For heat dissipation and insulation sealing of semiconductor devices. Excellent workability with quick curing and low viscosity.

In the semiconductor industry, effective heat dissipation measures are essential due to the increasing density and performance of devices. Heat can lead to performance degradation and failure of devices, potentially shortening product lifespan. TE-7163 efficiently dissipates heat generated by semiconductor devices to the outside due to its high thermal conductivity, thereby improving device reliability. 【Application Scenarios】 - Heat dissipation insulation sealing for electronic devices such as industrial motors, coils, transformers, and capacitors. 【Benefits of Implementation】 - Prolonged device lifespan - Enhanced product reliability - Stable performance maintenance

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High Thermal Conductivity Epoxy Resin TE-7163 for Automotive Applications

High Thermal Conductivity Epoxy Resin TE-7163 for Automotive Applications

For automotive cooling systems. This epoxy resin is ideal for heat dissipation and insulation sealing.

In the automotive industry, there is a demand for improved cooling performance due to the increased performance of electronic devices. Particularly for components that tend to generate heat, such as engine control units and motors, effective heat dissipation measures are essential. If proper cooling is not implemented, it may lead to component failure or performance degradation. TE-7163 features high thermal conductivity, rapid curing, and low viscosity, contributing to the reliability of automotive cooling systems. 【Application Scenarios】 - Industrial motors - Coils - Capacitors 【Benefits of Implementation】 - Efficient heat dissipation due to high thermal conductivity - Increased productivity due to rapid curing - Improved workability due to low viscosity

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High Thermal Conductivity Epoxy Resin TE-7900 for Robotics

High Thermal Conductivity Epoxy Resin TE-7900 for Robotics

Low-viscosity epoxy resin that solves the heat dissipation problem of high-output robots.

In the robotics industry, the increase in output power has led to a higher risk of performance degradation and failures due to heat generation. In particular, heat dissipation measures for motors and drive components are critical issues that affect the reliability and lifespan of robots. The TE-7900 addresses these challenges with its high thermal conductivity and low viscosity. 【Application Scenarios】 - Insulation and heat dissipation sealing for high-output motors - Heat dissipation measures for power electronics components - Thermal management for robotic arms and drive units 【Benefits of Implementation】 - Suppression of component overheating and stabilization of performance - Extension of product lifespan - Improvement of robot system reliability

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High thermal conductivity epoxy resin for semiconductors TE-7127

High thermal conductivity epoxy resin for semiconductors TE-7127

Achieving both high thermal conductivity and ease of use. We solve the heat dissipation challenges of semiconductors.

In the semiconductor industry, effective heat dissipation measures are essential due to the increasing density and performance of devices. Heat can lead to performance degradation and failure of devices, potentially compromising product reliability. TE-7127 achieves both high thermal conductivity and excellent insulation, contributing to improved heat dissipation performance of semiconductor devices and enhancing product reliability. 【Application Scenarios】 - High-performance processors such as CPUs and GPUs - Power semiconductor devices - LED lighting 【Benefits of Implementation】 - Suppression of device temperature rise - Extension of product lifespan - Stabilization of performance

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High Thermal Conductivity Epoxy Resin TE-7127 for Automotive Applications

High Thermal Conductivity Epoxy Resin TE-7127 for Automotive Applications

High thermal conductivity epoxy resin contributing to the improvement of automotive cooling performance.

In the automotive industry, as the miniaturization and high performance of electronic components progress, thermal management has become an important issue. In particular, for heat-generating components such as engine control units (ECUs) and power semiconductors, efficient cooling is essential. If appropriate thermal measures are not implemented, it can lead to component failure or performance degradation, potentially compromising the reliability and safety of the vehicle. TE-7127 balances high thermal conductivity and ease of use, contributing to the improvement of automotive cooling performance. 【Usage Scenarios】 - Sealing of ECUs - Heat dissipation of power semiconductors - Thermal management of in-vehicle electronic devices 【Benefits of Implementation】 - Extended lifespan of electronic components - Improved reliability of vehicles - Enhanced cooling efficiency

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High thermal conductivity epoxy resin TE-7163 (2Wm/k)

High thermal conductivity epoxy resin TE-7163 (2Wm/k)

This is an epoxy resin recommended for heat dissipation and insulation sealing of motors, coils, capacitors, and more. It offers good workability due to its short curing time and low viscosity.

TE-7163 Two-component heating curing epoxy resin Features: High thermal conductivity, short curing time, low viscosity Applications: Heat dissipation insulation sealing for electronic devices such as industrial motors, coils, transformers, and capacitors ■Mixing viscosity: 25℃ 12,500 / 60℃ 2,000 (mPa·s) ■Thermal conductivity: 2.0 (W/mK) ■Recommended curing conditions: 120℃ x 1h + 150℃ x 1h *For more details, please download the PDF from the bottom or feel free to contact us.

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High thermal conductivity epoxy resin TE-7127 (4 W/m·K)

High thermal conductivity epoxy resin TE-7127 (4 W/m·K)

Metal-based fillers are dispersed and blended into epoxy resin to achieve high thermal conductivity. This formulation aims to balance high thermal conductivity with usability.

TE-7127 Two-component heating curing epoxy resin Features: High thermal conductivity, short curing time, environmentally friendly (non-lead, non-halogen), low thermal expansion The linear expansion coefficient is low at 14, making it less prone to cracking. Applications: Used in general electronic components where both insulation and high thermal conductivity are required, such as casting agents, sealing materials, and surface protectants. ■ Mixing viscosity: 60℃ 15,000 (mPa·s) ■ Thermal conductivity: 4.0 (W/mK) ■ Flame retardancy: Equivalent to V-0 ■ Recommended curing conditions: 120℃ x 1h + 150℃ x 1h *For more details, please download the PDF from below or feel free to contact us.

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High Thermal Conductivity Epoxy Resin TE-7900 for Semiconductors

High Thermal Conductivity Epoxy Resin TE-7900 for Semiconductors

Epoxy resin that enhances heat dissipation and improves the reliability of semiconductor devices.

In the semiconductor industry, effective heat dissipation measures are essential due to the increasing density and performance of devices. The rise in heat generation can lead to performance degradation and a shorter lifespan of devices, making it necessary to efficiently dissipate heat. TE-7900 enhances the heat dissipation of semiconductor devices due to its high thermal conductivity, contributing to improved reliability. 【Usage Scenarios】 - Heat dissipation insulation sealing for CPUs, GPUs, power semiconductors, etc. - Heat dissipation for high-power LEDs - Potting for various electronic components 【Benefits of Implementation】 - Suppression of device temperature rise - Extension of product lifespan - Assurance of high reliability

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High Thermal Conductivity Epoxy Resin TE-7900 for Automotive Applications

High Thermal Conductivity Epoxy Resin TE-7900 for Automotive Applications

Low viscosity, high thermal conductivity epoxy resin that contributes to improving the cooling performance of automobiles.

In the automotive industry, as the miniaturization and high performance of electronic devices progress, heat dissipation measures have become an important issue. In particular, electronic components such as Engine Control Units (ECUs) and power semiconductors require reliability under high-temperature conditions. TE-7900 achieves both high thermal conductivity and low viscosity, addressing these challenges. This enhances the heat dissipation of electronic components and contributes to the longevity and performance maintenance of products. 【Application Scenarios】 - ECU (Engine Control Unit) - Power Semiconductors - Onboard Motors 【Benefits of Implementation】 - Improved heat dissipation of electronic components - Enhanced product reliability - Extended product lifespan - Support for miniaturization and high performance

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